Thermal Management Solutions for Automotive Electronics Products

Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.

Learn more about SILCOOL TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.

SNAPSIL TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer

XE11-B5320 is a one-component, low volatile paste, alkoxy cure, thermally conductive silicone adhesive sealant.

SILCOOL™ TIA235G