Thermally Conductive Gap Fillers Products

SILCOOL TIA141GF is a dispensable, 1-component, pre-cured thermal gap filler. Its non-slump characteristics after dispense can provide physical stability to retain shape until assembly, and since it is a dispensable material, TIA141GF flows can conform to complex designs and non-uniform thicknesses of assemblies at minimized assembly pressures.

Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.

SILCOOL TIA268GF silicone is a 2-component, soft, thermally conductive material that can dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for optimized processing.

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer

SILCOOL™ TIA235G

SILCOOL™ TIS420C

SILTRUST™ LTR495

SILTRUST™ LTR495 is a two-component, thermally conductive silicone paste that cures at room temperature, and faster with the addition of heat, to form a soft, heat dissipating, low outgassing rubber

TIA222G Thermally Conductive Silicone

TIA222G thermally conductive silicone is a two-component material used for encapsulating, gap filling, and as a thermal path to heat sinks.

TIS370C