Thermal Management for Automotive Electronics

With devices designed to be smaller, more powerful and more efficient, operating temperatures are increasing. Higher energy density directly translates into more heat. Therefore, the entire electronics industry is looking for better ways to cool and control the temperature of electronic devices. This trend can be seen across many industry segments, ranging from Automotive to Consumer & Lighting, and from Industrial Automation to Aviation & Aerospace.

Key Drivers:

• Miniaturization and system integration
• Higher energy density - More electronics in the same or less space
• New chip technologies (GaN & SiC)that will influence TIM1 & TIM2 temperature
• Higher performance & more efficient & higher reliability
• Smaller and lighter weight form factor

Thermal Adhesives

Our thermal adhesives offer enhanced adhesion performance and bond strength. Due to their elastomeric properties, they can continue dampening even with high filler loadings, and provide high adhesion strength to allow elimination of screws. Because they are silicone-based, these adhesives can work in intense heat and very harsh environments, protecting against aggressive substances, and acting as a sealant, vibration dampener, as well as a heat conductor or insulator.

We offer a wide variety of 1- and 2-part adhesives with varying viscosity levels and cure mechanisms:

• SilCool* TIA350R adhesive
• XE11-B5320T adhesive
• TN3085 adhesive

Read more about Momentive's Thermal Adhesive Materials

Thermally Resistant Gap Fillers

Momentive's SilCool* gap fillers are used to enhance heat transfer by filling air gaps and voids , and are widely targeted by applications where low stress and good interface wetting are required. These products also offer tacky adhesion for applications where movement in x, y, and z directions occurs due to vibration, thermal cycling stress and CTE (coefficient of thermal expansion) mismatch. SilCool gap fillers offer exceptional performance in terms of reliability, adhesion, and thermal resistance. While initially proposed for automotive applications (e.g. automotive electronic control units and systems), SilCool gap fillers are now also  used in consumer, telecommunications, and HMI applications where heat must be removed efficiently.

• TIA225GF gap filler
• SilCool TIA241GF gap filler
• TIA223G-DG gap filler